图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
|
|
|
散热片
|
|
散热片 Extrusion, 6 Foot Bar, Perimeter 15.98 Inch, Rev. F
|
暂无价格
|
参考库存:29530
|
|
|
|
散热片
|
|
散热片 Standard heatspreader for Qseven module conga-QG. All standoffs are with 2.7mm bore hole.
|
暂无价格
|
参考库存:29535
|
|
|
|
散热片
|
|
散热片 Passive cooling solution for Qseven module conga-QA6 with Intel Atom processor E6xx series and 6mm fin height. All stand-offs are with 2.7mm bore hole.
|
暂无价格
|
参考库存:29540
|
|
|
|
散热片
|
|
散热片 maxiFLOW BGA Heatsink, Thermal Tape, Blue-Anodized, T412, 45x45x7.5mm
|
暂无价格
|
参考库存:29545
|
|
|
|
散热片
|
|
散热片 Slide-On Style Board Level Stamped Heatsink for TO-218, Copper, Vertical Mounting, 23.1 n Thermal Resistance, Tin Plated, 2.54mm Hole
|
暂无价格
|
参考库存:29550
|