| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
|
|
|
|
散热片
|
|
散热片 Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. Intended for versions up to 17W TDP * Cu = Copper plate * T = M2.5 threaded standoffs
|
暂无价格
|
参考库存:27976
|
|
|
|
|
散热片
|
|
散热片 Standard passive cooling solution for COM Express module conga-TCA/CCA with 10mm fins. All stand-offs are M2.5mm thread.
|
暂无价格
|
参考库存:27981
|
|
|
|
|
散热片
|
|
散热片 Diamond Shaped Basket Stamped Heatsink for TO-66, Low-Cost, Horizontal Mounting, 8 n Thermal Resistance, Black Anodized, 25.4mm
|
3,000:¥17.4472
|
参考库存:27986
|
|
|
|
|
散热片
|
|
散热片 High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x152.4mm
|
暂无价格
|
参考库存:27991
|
|
|
|
|
散热片
|
|
散热片 maxiFLOW BGA ASIC Cooling Heatsink, High Performance, No TIM, 50x45x16mm
|
暂无价格
|
参考库存:27996
|