| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
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暂无价格
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参考库存:27449
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散热片
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散热片 maxiFLOW superGRIP Heatsink Assembly, Low Profile, T766, Black-Anodized, 34.25x34.25x19.5mm
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100:¥119.9495
500:¥109.271
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参考库存:27454
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散热片
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散热片 Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 50.8x12.7x12.7mm
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暂无价格
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参考库存:27459
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散热片
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散热片 Semiconductor Mounting Pad for TO-18, Circular, Dialyl Phthalate (DAP), 3.05x8.71mm
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暂无价格
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参考库存:27464
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散热片
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散热片 Extrusion, 8.25 Foot Bar
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1:¥9,248.9257
5:¥8,930.1188
10:¥8,632.4316
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参考库存:27469
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