图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 35x35x25mm, IC Pkg Size = 35 x 35, Tape #32
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暂无价格
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参考库存:27364
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散热片
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散热片 25MM HEATSINK ASSEMBLY
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暂无价格
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参考库存:27369
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散热片
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散热片 Chipset Heatsink, Elliptical, 29mm Chip Size, 27.6mm Height, Aluminum, Black Anodized
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暂无价格
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参考库存:27374
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散热片
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散热片 Chipset Heatsink with Clip, Elliptical, 31mm Chip Size, 31.6mm Height, Aluminum, Black Anodized
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暂无价格
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参考库存:27379
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散热片
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散热片 Standard passive cooling solution for COM Express Type 10 module conga-MA30 with cooling fins. All stand-offs are with M2.5 thread.
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暂无价格
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参考库存:27384
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