| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 31.75x31.75x9.5mm, 31.75mm dia.
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暂无价格
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参考库存:31496
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散热片
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导热接口产品 Semiconductor Mounting Pad for TO-18, DAP, 4 Leads, 5.08mm OD, 1.52mm Thickness
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暂无价格
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参考库存:31501
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散热片
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散热片 Square Basket Style Board Level Heatsink for TO-3, Slanted Fins, Horizontal Mounting, 7.2 n Thermal Resistance, Black Anodized, 12.7mm
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暂无价格
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参考库存:31506
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散热片
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散热片 50.8x34.92x12.7mm Pin extrusion TO-220
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暂无价格
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参考库存:31511
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散热片
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散热片 Semiconductor Mounting Pad for TO-5, DAP, 4 Leads, Diameter 8.89mm
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暂无价格
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参考库存:31516
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